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            Custom-made Ceramic
            and Glass Components

            High Thermal Conductivity Silicon Nitride

            Goodfellow can now offer high thermal conductivity Silicon Nitride. This material is ideal for specialist applications, and offers several benefits.

            • High thermal conductivity of 100W/mK. Which is 4X higher than standard Silicon Nitride. 
            • High fracture toughness. 
            • Can be polished to a surface roughness of Ra = 0.02um.  
            • Excellent mechanical properties.

            Typical Properties of this material

            Properties

            Units

            High Thermal Conductivity Silicon Nitride

            Density

            g/cm3

            3.3

            Flexural Strength

            (25°C) (MPa)

            700

            Linear Expansion Coefficient

            (25-800°C) (1/K)

            3x10-6

            Thermal Conductivity

            W/mK

            100

            Youngs Modulus

            GPa

            312

            Poissons Ratio

             

            0.29

            Volume Resistivity

             

            >1013

            Typical Applications

            • Power module substrates
            • Various types of heat sinks
            • LED mounting substrates
            • High frequency circuit substrates

            Shapes and sizes available

            The standard substrate size is 100mm x 100mm with a 0.32mm thickness. Different sizes and thicknesses are available upon request.

             

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